{"id":4481,"date":"2024-08-27T11:16:00","date_gmt":"2024-08-27T03:16:00","guid":{"rendered":"http:\/\/www.advancenb.com\/?page_id=4481"},"modified":"2024-09-29T19:32:17","modified_gmt":"2024-09-29T11:32:17","slug":"ap0300we-details-en","status":"publish","type":"page","link":"http:\/\/www.advancenb.com\/en\/product-series-en\/fully-automatic-die-attach-en\/ap0300we-details-en\/","title":{"rendered":"AP0300WE"},"content":{"rendered":"\n\n\t\t\t\t\n
AP0300WE<\/b><\/p>\n\t
FEATURES\uff1a<\/strong><\/p>\n1. 3D stacking up to 5mm
\n2. Class 100 Cleanroom (Optional)
\n3. Wafer Mapping system
\n4. Real time correction of visual center
\n5. Flexible multi reference patch
\n6. High accuracy wafer level packaging
\n7. Integrated online contact height measurement
\n8. High and low magnification dual field vision system
\n9. High-speed and high-precision Dual driven Gantry System
\n10. Expandable for traditional Die attach\uff08C2S\uff09, and Die sorting
\n11. High precision Pre-Pattern and flexible dispensing\uff0csupport overlay of dispensing patterns\n\n\t\tTECHNICAL SPECIFICATION\n\t<\/h2>\n