{"id":4459,"date":"2024-08-27T10:16:51","date_gmt":"2024-08-27T02:16:51","guid":{"rendered":"http:\/\/www.advancenb.com\/?page_id=4459"},"modified":"2024-09-29T19:44:25","modified_gmt":"2024-09-29T11:44:25","slug":"s450-bw-details-en","status":"publish","type":"page","link":"http:\/\/www.advancenb.com\/en\/product-series-en\/multi-functional-wire-bonder-en\/s450-bw-details-en\/","title":{"rendered":"S450-BW"},"content":{"rendered":"\n\n\t\t\t\t\n
S450-BW<\/p>\n\t
FEATURES\uff1a<\/strong><\/p>\n1. Close loop force control
\n2. EFO controlled by CPLD
\n3. DSP phase lock, stable ultrasonic output
\n4. Drive by electricity without compressed air
\n5.\u00a0 Self-study Chinese GUl for advanced process
\n6.\u00a0 Unique tailless bumping process and super adaptability for soft substrates\n\n\t\tTECHNICAL SPECIFICATION\n\t<\/h2>\n
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\n\t\t\t \n\t\t\t\t\t\t\t\n\t\t\t\t\t<\/th>\t\t<\/tr>\n\t<\/thead>\n\t\t Bond Wire<\/th> Au(15~75um),Pt(18~25\u03bcm),Ag(18~50\u03bcm),Al(18~100\u03bcm)<\/td><\/tr> Device Depth<\/th> Ball Bonding Max:15mm,Wedge Bonding Max:21mm<\/td><\/tr> Type of Bonding Tools<\/th> 16mm Ball Bonding Tools\uff1b\n19mm,25mm Wedge Bonding Tools<\/td><\/tr> Spool<\/th> Standard :1\/2 inch\uff1bOptional : 2 inch<\/td><\/tr> Bond Force<\/th> 1~250g<\/td><\/tr> Bond Power<\/th> Numerical control,1000x subdivision<\/td><\/tr> Clamping Table<\/th> Maximum Temperature 200\u2103<\/td><\/tr>\t<\/tbody>\n<\/table>\n \n\t\t\t\n\t\t
\n\t\t\t \n\t\t\t\t\t\t\t\n\t\t\t\t\t<\/th>\t\t<\/tr>\n\t<\/thead>\n\t\t Bond Head Z Range<\/th> 18mm<\/td><\/tr> Bond Head X-Y Range<\/th> X=15mm,Y=15mm<\/td><\/tr> Lifting Table Z Range<\/th> 0~18mm<\/td><\/tr> Lifting Table X-Y Range<\/th> 250mm\u00d7270mm<\/td><\/tr> Input Voltage<\/th> 220V\u00b110%@50~60Hz<\/td><\/tr> Power Consumption<\/th> \u2264500W<\/td><\/tr> Weight<\/th> GW.\u224847kg,NW.\u224870kg<\/td><\/tr> Footprint<\/th> \u2264620mm x 640mm x 450mm(W x D x H)<\/td><\/tr>\t<\/tbody>\n<\/table>\n \n\t\tVIDEO\n\t<\/h2>\n\t