{"id":4450,"date":"2024-08-27T10:05:40","date_gmt":"2024-08-27T02:05:40","guid":{"rendered":"http:\/\/www.advancenb.com\/?page_id=4450"},"modified":"2024-09-29T19:45:05","modified_gmt":"2024-09-29T11:45:05","slug":"s450p-b-details-en","status":"publish","type":"page","link":"http:\/\/www.advancenb.com\/en\/product-series-en\/multi-functional-wire-bonder-en\/s450p-b-details-en\/","title":{"rendered":"S450P-B"},"content":{"rendered":"\n\n\t\t\t\t\"S450P-BW\"\n
\n\t\tMULTI-FUNCTIONAL WIRE BONDER(BALL)\n\t<\/h5>\n\t

S450P-B<\/p>\n\t

FEATURES\uff1a<\/strong><\/p>\n1.\u00a0 High precision close loop force control(accuracy within 1g)
\n2. Support high\/low frequency transducer
\n3. One key switch high\/low power
\n4. Drive by electricity without compressed air
\n5. Unique tailless bumping process
\n6. Bond head designed by parallelogram support large module of deep access\n

\n\t\tTECHNICAL SPECIFICATION\n\t<\/h2>\n\n\t\t\t\n\t\t\n\t\t\t\n\t\t
\t\t\t\t\t\n\t\t\t\t\t<\/th>\t\t<\/tr>\n\t<\/thead>\n\t\t
Bond Wire<\/th>Au(15~75\u03bcm),Pt(18~25\u03bcm),\nCu(18~50\u03bcm),Ag(18~50\u03bcm)<\/td><\/tr>
Device Depth<\/th>Max:15mm<\/td><\/tr>
Type of Bonding Tools<\/th>19mm\u300116mm<\/td><\/tr>
Spool<\/th>Standard :1\/2 inch\uff1bOptional : 2 inch<\/td><\/tr>
Bond Force<\/th>1~250g<\/td><\/tr>
Bond Power<\/th>Numerical control,1000x subdivision<\/td><\/tr>
Clamping Table<\/th>Maximum Temperature 200\u2103<\/td><\/tr>\t<\/tbody>\n<\/table>\n\n\t\t\t\n\t\t\n\t\t\t\n\t\t
\t\t\t\t\t\n\t\t\t\t\t<\/th>\t\t<\/tr>\n\t<\/thead>\n\t\t
Bond Head Z Range<\/th>18mm<\/td><\/tr>
Bond Head X-Y Range<\/th>X=15mm,Y=15mm<\/td><\/tr>
Lifting Table Z Range<\/th>0~18mm<\/td><\/tr>
Lifting Table X-Y Range<\/th>250mm\u00d7270mm<\/td><\/tr>
Input Voltage<\/th>220V\u00b110%@50~60Hz<\/td><\/tr>
Power Consumption<\/th>\u2264500W<\/td><\/tr>
Weight<\/th>GW.\u224847kg,NW.\u224870kg<\/td><\/tr>
Footprint<\/th>\u2264620mm x 640mm x 450mm(W x D x H)<\/td><\/tr>\t<\/tbody>\n<\/table>\n

\n\t\tVIDEO\n\t<\/h2>\n\t
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