HIGH ACCURACY EPOXY DIE ATTACH
DA0300SE
FEATURES：
1. Flexible multi reference patch
2. High precision force control, with an accuracy of ±1g
3. High-speed and high-precision Dual driven Gantry System
4. Transfer station assisted high-precision positioning function
5. High precision up-look and down-look vision positioning system
6. Pipeline operation in the placement machine, with optional workbench mode
7. High precision Pre-Pattern and flexible dispensing，
8. Support overlay of dispensing patterns
9. Integrated online contact height measurement，dispensing needle height measurement is also available（Optional）
TECHNICAL SPECIFICATION
| Positioning Accuracy | ±3μm@3sigma |
|---|---|
| Angular Accuracy | ±0.15° |
| Height Measurement Accuracy | ±1μm |
| Force Control Accuracy | ±1g |
| Stroke | X=386mm，Y=716mm，Z=50mm |
| Die Size | Min. 0.38mm x 0.38mm，Max. 7mm x 7mm |
| Waffle Pack/Gel-Pak size | 2 inches,compatible with 4 inches |
| Waffle Pack/Gel-Pak Quantity | 18x (2 inches) , 2x (4 inches),or26x(2 inches) |
| Nozzle Quantity | 12（Including height measurement） |
|---|---|
| Height Measurement Method | Contact Measurement |
| Adhesive Type | Epoxy |
| Epoxy Volume | 3cc、5cc、10cc |
| Minimum adhesive spot diameter | ?0.3mm |
| Bonding Force | 10~690g |
| Operating System | Windows |
| Weight | 1.6T |
FACILITY REQUIREMENT
| Power Input | 220V±10%@50/60Hz |
|---|---|
| Power Consumption | 2KW |
| Footprint | 970mm x 1570mm x 2040mm (W x D x H) |
| Air Pressure | 0.4 ~ 0.6MPa |
|---|---|
| Vacuum Pressure | ≤ -85kPa |