MULTI-FUNCTIONAL WIRE BONDER（Ball & Wedge）
S450P-BW
FEATURES：
1. High precision close loop force control (Accuracy within 1g)
2. High stability of bond point
3. One key switch frequency
4. Drive by electricity without compressed air
5. Unique tailless bumping process and super adaptability for soft substrates
6. Bond head designed by parallelogram support large module of deep access
TECHNICAL SPECIFICATION
| Bond Wire | Au(15~75μm),Pt(18~25μm),Cu(18~25μm),Ag(18~50μm),Gold Ribbon(12.7 x 50μm~25.4 x 300μm) |
|---|---|
| Device Depth | Ball Bonding Max:15mm,Wedge Bonding Max:21mm |
| Type of Bonding Tools | 16mm Ball Bonding Tools； 19mm,25mm Wedge Bonding Tools |
| Spool | Standard :1/2 inch；Optional : 2 inch |
| Bond Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200℃ |
| Bond Head Z Range | 18mm |
|---|---|
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Lifting Table X-Y Range | 250mm×270mm |
| Input Voltage | 220V±10%@50~60Hz |
| Power Consumption | ≤500W |
| Weight | GW.≈47kg,NW.≈70kg |
| Footprint | ≤620mm x 640mm x 450mm(W x D x H) |