ZH6000-B automatic deep access wire bonder
FULLY AUTOMATIC DEEP ACCESS WIRE BONDER（BALL）

ZH6000-B

FEATURES：

1. Real time deformation monitoring
2. Real time ultrasonic monitoring
3. Fixed length and height loop control
4. Piezo ultrasonic motor for tail control
5. Support 16mm、19mm capillary(deep access)
6. Assist camera for bond head maintenance
7. Large bonding area

TECHNICAL SPECIFICATION

Bonding Precision±3μm@3sigma
Bonding Speed≥4 wires/s
Bonding Wire TypeGold wire(18um~75um)
Bonding AreaMax area:305mmx457mm,rotation:0~180°
Device DepthMax:12mm
Capillary Length16mm/19mm
Loop ControlProgrammable, fixed length and height loop control
Ultrasonic0~4W control precision,support ramp mode 1mW resolution
Bonding Force0~220g
Operating SystemWindows
Weight1.2T

FACILITY REQUIREMENT

Power Input220V±10%@50~60Hz
Power Consumption2KW
Air Pressure≥0.35MPa
Footprint≤1000mm x 1500mm x 1700mm(W x D x H)