Elite electronics professionals from Sichuan and Chongqing gathered, and Shangjin Automation contributed to the successful holding of the skills competition.
In June, the finals of the Third Sichuan-Chongqing Electronic Information Industry Workers' Vocational Skills Competition and the 2024 Chengdu Million Workers Skills Competition were successfully held in Sichuan.
As a supporting organization, Shangjin Automation provided S450 series multi-functional wire bonders as practical competition equipment for the Hybrid Integrated Circuit Assembly and Adjustment competition. Additionally, the company offered professional product training and technical support during the competition to the participants.
S450 Series Multi-functional Wire Bonder
The S450 series multi-functional wire bonder is one of the essential key equipment in the post-packaging process of the semiconductor production line. Customers can choose from various models based on product design and process requirements, including ball bonding (S450-B), wedge bonding (S450-W), combined ball and wedge bonding (S450-BW), and ribbon bonding (S450-RW) machines. These devices are suitable for discrete devices, microwave components, optical communication devices, sensors, MEMS, surface acoustic wave devices, RF modules, power devices, and more.
During the competition, the following two models were primarily utilized:
