MULTI-FUNCTIONAL WIRE BONDER(BALL)
S450-B
FEATURES：
1. Close loop force control
2. EFO controlled by CPLD
3. DSP phase lock,stable ultrasonic output
4. Drive by electricity without compressed air
5. Self-study Chinese GUl for advanced process
6. Unique tailless bumping process and super adaptability for soft substrates
7. Bond head designed by parallelogram support large module of deep access
TECHNICAL SPECIFICATION
| Bond Wire | Au(15~75μm),Pt(18~25μm),Ag(18~50μm) |
|---|---|
| Device Depth | Max:15mm |
| Type of Bonding Tools | 16mm/19mm |
| Spool | Standard :1/2 inch；Optional : 2 inch |
| Bond Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200℃ |
| Bond Head Z Range | 18mm |
|---|---|
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Lifting Table X-Y Range | 250mm×270mm |
| Input Voltage | 220V±10%@50~60Hz |
| Power Consumption | ≤500W |
| Weight | GW.≈47kg,NW.≈70kg |
| Footprint | ≤620mm x 640mm x 450mm(W x D x H) |